Application Note (126 in all)
Introduction：AN169 is used to introduce how to migrate from the GD32E230 series to the GD32E235 series, and related precautions.
Introduction：AN184 is used to introduce how to migrate from the GD32L233 series to the GD32L235 series, and related precautions.
Introduction：AN198 provides a general introduction to the comparators in the GD32G5x3 series of products, making it easier for developers to quickly get started with the comparator module of the GD32G5x3 series.
Introduction：AN204 introduces the module usage precautions when developing on GD32G5x3 MCUs.
Introduction：AN218 mainly introduces the method of migrating from GD32E5xx to GD32G5xx series.
Introduction：AN210 is designed for the GD32G5x3 product. It introduces the method of adjusting the clock sampling point in QSPI high-speed mode.
Introduction：AN207 is designed to describe the Trigonometric Math Unit of GD32G5x3 series products, so as to allow developers to quickly get started and use GD32G5x3 series products.
Introduction：AN181 introduces the I2C noise filter of the GD32 MCU and the calculation of related hold and setup times.
Introduction：The section describes the I2C Bootloader communication protocol and the data interaction process
Introduction：AN030 introduces the characteristic differences between GD32F47x/F42x and GD32F45x/40x product series, mainly for electric characteristics and peripheral function characteristics.
Introduction：AN206 is mainly for GD32H7xx series, scatter loading instruction in Keil.
Introduction：AN136 describes in detail the precautions in the migration process of the IEC60730 ClassB certification library for GD32F30x series chips under different IDEs, and helps customers to achieve IEC60730 standard certification.
Introduction：AN156 describes in detail the precautions in the migration process of the IEC60730 ClassB certification library for GD32F4xx series chips under different IDEs, and helps customers to achieve IEC60730 standard certification.
Introduction：AN171 describes in detail the precautions in the migration process of the IEC60730 ClassB certification library for GD32F3x0 series chips under different IDEs, and helps customers to achieve IEC60730 standard certification.
Introduction：AN192 describes how to use GD32 MCU for spreading frequency testing, and uses GD32F470 as an example to introduce the relevant operation steps and their impact.
Introduction：AN197 describes the module usage precautions when developing on GD32L23x MCUs.
Introduction：AN95 aims to guide customers on ways to improve the accuracy of GD32 MCU temperature sensors.
Introduction：AN195 is designed for the GD32F5xx dual-bank flash product. It introduces the dual-bank code update and switch bank boot function.
Introduction：AN179 introduces the characteristic differences between GD32L235 and GD32EL233 product series, mainly for electric characteristics and peripheral function characteristics.
Introduction：AN175 mainly introduces the GD32A503/A513 series ECC two-bit errors and common handling methods.
Introduction：AN201 mainly introduces that the MCU frequency is high, FLASH can be used to simulate EEPROM to reduce the cost. In this document, a method of simulating EEPROM with FLASH is introduced, which realizes the EEPROM data modification by byte, and can prevent the data lost by software reset or power reset.
Introduction：AN194 is used to introduce how to migrate from the GD32F4xx series to the GD32F5xx series, and related precautions.
Introduction：AN196 mainly introduces that the MCU frequency is high, FLASH can be used to simulate EEPROM to reduce the cost. In this document, a method of simulating EEPROM with FLASH is introduced, which realizes the EEPROM data modification by byte, and can prevent the data lost by software reset or power reset.
Introduction：AN163 provides some EMC protection design references for MCU hardware design, aiming to help optimize the EMC performance of MCU in the product application process.
Introduction：AN146 is mainly used to introduce the differences between GD32E235 and GD32E230 series, including peripherals, electrical characteristics, etc.
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